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Flip Chip Technology

In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performance, flexibility, reliability, and cost over other packaging methods. There are three stages in making flip chip assemblies: bumping the die or wafer, attaching the bumped die to the board or substrate, and, in most cases, filling the remaining space under the die with an electrically non-conductive material. Several varieties of flip chip assembly are solder bump, plated bump, gold stud bump, and adhesive bump suit flip chip which are used in a wide range of applications.

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